Dear Ladies and Gentlemen,
We are excited to announce that H-Square Corporation, in partnership with Nagase Techno-Engineering Co., Ltd., will be exhibiting at SEMICON Japan 2025, taking place from December 17th-19th at Tokyo Big Sight!
Closing off the year with one of the biggest events within the semiconductor industry, SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2025 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT).
Join us to discover our latest innovations in semiconductor handling solutions and explore how our technology can enhance your manufacturing processes. The Nagase team will be more than happy to assist with experts readily available to discuss your specific requirements and demonstrate our products at the forefront of the semiconductor industry. H-Square's automation solutions are for your wafer transferring needs, including the WS200-3 and following products:
Nagase Techno-Engineering Co., Ltd (NTE), established in 1989, specializes in the design, manufacturing, sales, and maintenance of equipment and systems for various industries. Their offerings include low-temperature and vacuum-related equipment, chemical management and recycling systems, surface defect inspection systems, and semiconductor manufacturing tools.
Nagase Techno Service has developed and continues to expand its diversified services in a wide range of business areas, including โdistribution processing and logistics agency servicesโ โmail order distribution-related servicesโ and โsensor-related servicesโ by leveraging the technological and integration strengths of the NAGASE Group.
Particularly focused on the creative perspective that creates new services through the fusion of products and technology, NAGASE Group as a company develops business from a position close to the end user within the company, aiming to provide high value-added services that meet the needs and trends of the market by sincerely addressing the challenges of customers.
Since its inception in 1975, H-Square has consistently been at the cutting edge of wafer handling tool design, engineering, and manufacturing, playing a pivotal role in shaping the microelectronics industry. Over the years, we have built a solid and well-earned reputation as a trusted and innovative supplier, offering a diverse range of both manual and automated equipment solutions. Our commitment to excellence is reflected in the quality of our products and the dependable service we provide to our customers.
At H-Square, we pride ourselves not only on the technological sophistication of our offerings but also on our unwavering dedication to exceptional customer service. We approach each partnership with a collaborative mindset, working closely with our clients to understand their specific needs and deliver solutions that drive success. Our focus on building strong, long-lasting relationships is central to our business philosophy, ensuring that we continue to be a reliable partner for all of our customersโ wafer handling needs.
A stand-alone tabletop automation system features two-cassette stage configuration. A cost-effective automation tool designed to reduce wafer breakage and scratches. Compatible with industry standard shipping, process, and metal cassettes. Provides a highly flexible control system that any operator can use with minimal training.
The tool is operated from a touch screen display. Operators load the cassettes onto the stage.
To move wafers between cassettes, the operator can choose one of the three available modes:
Quick Transfer Mode will automatically move wafers from the Left Cassette to the Right Cassette or from the Right Cassette to the Left Cassette from pre-selected transfers.
Recipe Mode allows the operator to have a pre-determined transfer configuration for an allocated set of wafers from one preset amount of wafers
Manual Mode allows the operator to transfer wafers in a sequence of their choice.
A safe vacuum-less low-contact end-effector includes a wafer mapping sensor that maps wafer locations in each cassette and detects wafer presence for accurate movements.
SECS/GEM Tool Interface Integrated OCR Automated Pre-Aligner Features:
โข Single wafer transfer
โข Lot split transfer
โข Merge applications
โข Pitch change applications
โข "Fill" loading/removing test wafers from a parent lot
โข Scratch reduction by eliminating manual wafer handling
โข Combining wafer lots/splitting lots/odd-even
โข Thin wafer handling (up to 2mm warpage)
โข MEMS or Taikoยฎ (wafer edge end-effector option)
| Wafer Size | 100mm- 200mm |
|---|---|
| Power Requirements | 24VDC 3 Amps 120VAC to 24VDC Power Supply Specify when order |
