The Breeze provides state of the art touchless solutions for manually transferring wafers while introducing little to no stress to the substrate. The handling tools use compressed facility gases (typically Nitrogen or CDA - clean, dry air) to stream airflow from a center sparer cap or sparger tube to the perimeter to the wafer. Wafers are lifted from a surface, platen, cassette, or shipping container without touching the top or bottom surface of the wafer.

Following Bernoulli's principle pressure differential, the wafer is "floated" on the wand apparatus at approximately 200 microns from the surface of the Breeze plate. Coral pins limit sideways movement of retained wafer.

What is Bernoulli's Principle? 

1. An increase in the speed of a fluid co-occurs with a decrease in static pressure.
2. Pressure decreases as flow increases.
3. If you have a higher flow rate on one side of an object than the other side, the pressure differential pushes the object.
4. Carburetor venturis and airplanes are two typical applications of the Bernoulli principle
5. Compressed air (CDA), or Nitrogen is the fluid with the Breeze

H-Square offers two standard models of Breeze handling systems - the H2B - a 90 Degree perpendicular handle apparatus, and the H2BST - a horizontal offset handle configuration.