Standard Mechanical Interface (SMIF) pods and Front Opening Unified Pod (FOUP) carriers are based on an insolation technology developed in the 1980s at Hewlett-Packard, which are now widely used in semiconductor wafer fabrication and cleanroom environments worldwide. These systems play a critical role in wafer handling and photomask reticle handling, ensuring contamination-free operations. H-Square’s pod openers offer a cost-effective solution for accessing substrate storage pod carriers. With a comprehensive range of automated and manual stand-alone tools, H-Square provides reliable and efficient solutions to meet the needs of modern semiconductor manufacturing processes.
Standard Mechanical Interface (SMIF) pods and Front Opening Unified Pod (FOUP) carriers are based on an insolation technology developed in the 1980s at Hewlett-Packard, which are now widely used in semiconductor wafer fabrication and cleanroom environments worldwide. These systems play a critical role in wafer handling and photomask reticle handling, ensuring contamination-free operations. H-Square’s pod openers offer a cost-effective solution for accessing substrate storage pod carriers. With a comprehensive range of automated and manual stand-alone tools, H-Square provides reliable and efficient solutions to meet the needs of modern semiconductor manufacturing processes.
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