Tabletop, automatic high-value, thin wafer, compound wafer transfer tool. Wafers are gently bulk-lifted midpoint in the cassette slots before being extracted or loaded. This is to minimize contact with the cassette, eliminating chances of particulation or wafer edge chipping. High reliability and low maintenance. Small footprint saves valuable cleanroom space. Designed for ISO Class 3 (FS209E Class 1); Antistatic construction; Specify cassette model number(s) with order.
The LCT2 Features:
|Wafer Size||76, 100, 150, 200|
|Power Requirements||24VDC 3 Amps 120VAC to 24VDC Power Supply Sold seperately|
|Dimensions||10"W 30"L 16"H|
|Shipping Weight||95 lbs|
|Dimensions||16 × 36 × 24 in|
H-Square will ship the product to the customer using FedEx. Cost will be calculated using the FedEx website. H-Square does not charge an additional handling fee. If product is in inventory it will be shipped within 3 business days. If it is not in inventory, customer will be notified of the shipping date.
H-Square uses a Return Material Authorization (RMA) process. If you need to return a product, contact us at email@example.com to receive an RMA number. Please state name, product part number and reason for return. Once you receive the RMA number, ship the product back to H-Square. Customer is responsible for shipping costs to return product.