A stand-alone tabletop automation system features two-cassette stage configuration. A cost-effective automation tool designed to reduce wafer breakage and scratches. Compatible with industry standard shipping, process, and metal cassettes. Provides a highly flexible control system that any operator can use with minimal training.

The tool is operated from a touch screen display.  Operators load the cassettes onto the stage.  To move wafers between cassettes, the operator can choose one of the three available modes:

• Manual Mode
• Quick Transfer Mode
• Recipe Mode

A safe vacuum-less low-contact end-effector includes a wafer mapping sensor that maps wafer locations in each cassette and detects wafer presence for accurate movements.

Options:

• SECS/GEM Tool Interface
• Integrated OCR Automated
• Pre-Aligner

Features:

• Single wafer transfer
• Lot split transfer
• Merge applications
• Pitch change applications
• "Fill" loading/removing test wafers from a parent lot
• Scratch reduction by eliminating manual wafer handling
• Combining wafer lots/splitting lots/odd-even
• Thin wafer handling (up to 2mm warpage)
• MEMS or Taiko® (wafer edge end-effector option)