A stand-alone tabletop automation system features two-cassette stage configuration. A cost-effective automation tool designed to reduce wafer breakage and scratches. Compatible with industry standard shipping, process, and metal cassettes. Provides a highly flexible control system that any operator can use with minimal training.
The tool is operated from a touch screen display. Operators load the cassettes onto the stage. To move wafers between cassettes, the operator can choose one of the three available modes:
• Manual Mode
• Quick Transfer Mode
• Recipe Mode
A safe vacuum-less low-contact end-effector includes a wafer mapping sensor that maps wafer locations in each cassette and detects wafer presence for accurate movements.
Options:
Features:
• Single wafer transfer
• Lot split transfer
• Merge applications
• Pitch change applications
• "Fill" loading/removing test wafers from a parent lot
• Scratch reduction by eliminating manual wafer handling
• Combining wafer lots/splitting lots/odd-even
• Thin wafer handling (up to 2mm warpage)
• MEMS or Taiko® (wafer edge end-effector option)
| Wafer Size | 100mm- 200mm |
|---|---|
| Power Requirements | 24VDC 3 Amps 120VAC to 24VDC Power Supply Specify when order |
H-Square will ship the product to the customer using FedEx. Cost will be calculated using the FedEx website. H-Square does not charge an additional handling fee. If product is in inventory it will be shipped within 3 business days. If it is not in inventory, customer will be notified of the shipping date.
H-Square uses a Return Material Authorization (RMA) process. If you need to return a product, contact us at info@h-square.com to receive an RMA number. Please state name, product part number and reason for return. Once you receive the RMA number, ship the product back to H-Square. Customer is responsible for shipping costs to return product.
