Tabletop, automatic FOUP to FOSB wafer transfer tool. Wafers are mapped, then gently bulk-lifted in the cassette; minimizing contact with the cassette and eliminating the chances of particulation, abrasion, or wafer edge chipping. The sturdy construction assures high reliability, low maintenance, small footprint saves valuable cleanroom space. Antistatic construction; Specify cassette model number(s) with order. Designed for ISO Class 3
The LCT1AS12 Features:
| Wafer Size | 300 |
|---|---|
| Power Requirements | 24VDC 3 Amps 120VAC to 24VDC Power Supply Sold seperately |
| Throughput | 60 cassettes per hour |
| Weight | 75 lbs |
| Shipping Weight | 165 lbs |
|---|---|
| Dimensions | 19 × 35 × 20 in |
H-Square will ship the product to the customer using FedEx. Cost will be calculated using the FedEx website. H-Square does not charge an additional handling fee. If product is in inventory it will be shipped within 3 business days. If it is not in inventory, customer will be notified of the shipping date.
H-Square uses a Return Material Authorization (RMA) process. If you need to return a product, contact us at info@h-square.com to receive an RMA number. Please state name, product part number and reason for return. Once you receive the RMA number, ship the product back to H-Square. Customer is responsible for shipping costs to return product.
