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May 18, 2022
Excellent week in beautiful Monterey! CS MANTECH 2022

By Anna Allustiarti I May, 2022 I This year the CS Mantech conference started on Monday, May 9, with the workshops on the pandemic's impact on all aspects of compound semiconductor manufacturing technology. In the last two years, we all have been affected by supply chain shortages, so it felt relevant and important when speakers […]

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May 17, 2022
Inventive Wands Key to Safe Manual Handling of Fragile Substrates

By Karl Gartland I May 17, 2022 I Moving devices securely through fabrication without incurring loss or damage is essential for all successful IC production. It takes an intimate knowledge of materials science, chemistry, and electrical principles to produce efficient and successful edge ICs. But no matter how many improvements are made in controlling the […]

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December 22, 2021
Beginning January 1st, 2022 H-Square 300mm peek tips will only be offered in ESD PEEK

It is a well know fact that semiconductor wafer handling, mandates that electrostatic charge control is essential. In response beginning January 1st, 2022, H-Square 300mm PEEK tips will only by offered in ESD PEEK.

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December 3, 2021
斯科维尔(上海)半导体设备有限公司 – H-Square (Shanghai) Semiconductor Equipment Co., Ltd.

H-Square opened a new office in Shanghai, China, in response to the robust development of the semiconductor industry in that region.

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November 19, 2021
H-Square Executive Team Set to Guide Company into New Era Focused on Robotics, Automation and Intelligent Tools

H-Square Corporation is sharpening its market focus to develop new technologies in the key areas of robotics, automation and intelligent software tools.

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July 27, 2021
BLIS – Bright Light Inspection Station

H-Square’s second generation BLIS solution is a table-top macro-inspection station that utilizes a bright white 3995 Lumens programmable LED light to detect subtle, low-contrast defects on complex assemblies.

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July 27, 2020
LCT2 – Low Contact Transfer

The H-Square LCT2 Wafer Transfer is a third-generation automation transfer tool unique in combining cleanliness and true abrasion resistance for cutting-edge wafer production environments.

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