WS200. Simply Automatic

Your Automatic Single Wafer Transfer Solution

The  WS200 is a tabletop, stand-alone automated wafer transfer and sorting  system designed for 76–200 mm wafers. Built for fabs, pilot lines, and  advanced labs, the WS200 reduces manual handling, minimizes wafer damage, and  delivers reliable, repeatable transfers — without the complexity or footprint  of full-scale automation.

Have peace of mind with automated handling

Manual wafer handling increases risk: breakage, scratches, particles, and inconsistent results. The WS200 eliminates those risks by introducing simple, affordable automation exactly where it’s needed.

Designed for Precision and Protection

Low-Contact, Vacuum-Less Handling

The WS200 features a vacuum-less end-effector engineered to minimize contact points and particle generation. This design helps protect both standard and thin wafers while maintaining precise, repeatable movement.

Built-In Wafer Mapping Sensor

Integrated wafer mapping verifies wafer presence and position before transfer, ensuring accuracy and preventing handling errors

Flexible Transfer Modes for Any Workflow

The WS200 adapts easily to changing production needs with three intuitive operating modes:

Quick Transfer Mode will automatically move wafers from the Left Cassette to the Right Cassette or from the Right Cassette to the Left Cassette from pre-selected transfers.

Recipe Mode allows the operator to have a pre-determined transfer configuration for an allocated set of wafers from one preset amount of wafers

Manual Mode allows the operator to transfer wafers in a sequence of their choice.

All modes are accessed through a simple touchscreen interface, allowing operators to work efficiently with minimal training.

Compact, Cost-Effective Automation

With its tabletop footprint, the WS200 fits seamlessly into crowded lab environments and fab floors. It delivers automation benefits without the cost, space requirements, or integration overhead of larger wafer handling systems.

Ideal for:

• R&D and process development labs
• Pilot production lines
• High-mix, low-volume manufacturing
• Facilities transitioning from manual handling to automation

Optional Parts for the WS200

The WS200 can be configured with optional enhancements to support advanced factory environments:

• SECS/GEM Interface for automation and host communication
• OCR / ID Reader for wafer tracking and traceability
• Pre-Aligner for automated wafer orientation

These options allow the WS200 to grow with your operation — from standalone tool to connected automation node.

A safe vacuum-less low-contact end-effector includes a wafer mapping sensor that maps wafer locations in each cassette and detects wafer presence for accurate movements.

Functions of the WS200

• Single wafer transfer

• Lot split transfer

• Merge applications

• Pitch change applications

• "Fill" loading/removing test wafers from a parent lot

• Scratch reduction by eliminating manual wafer handling

• Combining wafer lots/splitting lots/odd-even

• Thin wafer handling (up to 2mm warpage)

• MEMS or Taiko®

Specifications

Shipping Info

Technical Snapshot

Technical Snapshot

• Wafer Size: 76–200 mm
• System Type: Stand-alone, tabletop automation
• Control Interface: Touchscreen
• Handling Method: Vacuum-less, low-contact end-effector
• Use Environment: Fab, pilot line, R&D lab

For any questions or inquiries:
Please email us at info@h-square.com