An edge-grip normally closed (consistent force) edge exclusion mechanical pick for handling round substrates from the wafer edge. The wafer contact pad is a per-fluorinated O-ring strip for
grip/hold on the wafer without scratching or leaving out-gassing behind. The knife-edge gripper is replaceable. Commonly used where double-sided wafers are being handled also in application labs and for wafer rescue applications.
The MCP2-23-S Features:
Wafer Size | 50, 76 |
---|---|
Dimensions | 7.2" x 1.4" x .7" |
Weight | 0.25 lbs |
$590.00
H-Square uses a Return Material Authorization (RMA) process. If you need to return a product, contact us at info@h-square.com to receive an RMA number. Please state name, product part number and reason for return. Once you receive the RMA number, ship the product back to H-Square. Customer is responsible for shipping costs to return product.