High-Quality Wafer Cassettes for 3" Wafers – Transfer & Sorting Solutions!

Now with support for 3" wafers and wafer cassettes, the WS200 standalone, tabletop automated wafer transfer and sorting system designed for 76–200 mm wafers provides ease to your semiconductor tasks. Built for fabs, pilot lines, and advanced labs, the WS200 reduces manual handling, minimizes wafer damage, and  delivers reliable, repeatable transfers — without the complexity or footprint  of full-scale automation.

Manual wafer handling increases risk: breakage, scratches, particles, and inconsistent results. The WS200 eliminates those risks by introducing simple, affordable automation exactly where it’s needed. Supported by an even more precise transfer solution for your 3" wafers, the WS200 can handle transfers delicately, efficiently, and consistently.

A safe vacuum-less low-contact end-effector includes a wafer mapping sensor that maps wafer locations in each cassette and detects wafer presence for accurate movements. H-Square has the solution for your next specialized wafer transfer needs.

All the features that come with the WS200-3 applies to the 3" cassettes. Customized options are also available for a variety of wafer sizes up to 200mm wafers and cassettes.

Optional Parts for the WS200, also compatible with 3" wafer cassettes

You can also find the same, optional WS200 can be configured with optional enhancements to support advanced factory environments:

• SECS/GEM Interface for automation and host communication
• OCR / ID Reader for wafer tracking and traceability
• Pre-Aligner for automated wafer orientation

These options allow the WS200 to grow with your operation — from standalone tool to connected automation node.

A safe vacuum-less low-contact end-effector includes a wafer mapping sensor that maps wafer locations in each cassette and detects wafer presence for accurate movements.

Functions of the WS200

• Single wafer transfer

• Lot split transfer

• Merge applications

• Pitch change applications

• "Fill" loading/removing test wafers from a parent lot

• Scratch reduction by eliminating manual wafer handling

• Combining wafer lots/splitting lots/odd-even

• Thin wafer handling (up to 2mm warpage)

• MEMS or Taiko®

Specifications

Shipping Info

Technical Snapshot

Technical Snapshot

• Wafer Size: 76–200 mm
• System Type: Stand-alone, tabletop automation
• Control Interface: Touchscreen
• Handling Method: Vacuum-less, low-contact end-effector
• Use Environment: Fab, pilot line, R&D lab

For any questions or inquiries:
Please email us at info@h-square.com