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T693PKAS3-001
Thin Wafer Handling Tips
  • Thin, one piece molded Press-Fit tip for general handling of thin or fragile substrates up to 200mm in diameter (.005" - .015" thick).

  • Molded from rigid carbon filled PEEK for strength and ESD protection.

  • Excellent adhesion to wafers with minimum distortion or stress to the substrate.

  • Applications include handling of larger size fragile substrates (e.g., GaAs, GN, SiGe, InGaP, etc.).



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                ETAS6

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AETWNA8AC
Patent# 5,551,829
Auto Wafer Aligners and Escalators
  • Aligns and escalates wafers in 24 seconds so operator can view ID.

  • Allows quick view of wafer edges and film patterns.

  • Small footprint saves tabletop space.

  • Units are modified to work with wafers as thin as 0.007".

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AFEZ-6AC
Patent # 4,662,811

Flat/Notch Finders

  • EZ Guide auto flat and notch  finders provide safe means of aligning thin wafer flats or notches.

  • Cassette positioning system assures that cassettes are seated correctly for safe operation.

  • ESD protected by static-dissipative plastics.

  • Proprietary static-dissipative polyurethane roller withstands more than 2,000,000 cycles with accuracy of less than +1º.

  • Units are modified to work with wafers as thin as 0.007".

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LCTAS8-AC

Low Contact Wafer Transfer Machine

  • Low contact transfer machine provides safe means of mass transferring thin wafers from cassette to cassette.

  • Wafers are gently lifted midpoint in the cassette slots before extracting or loading them to minimize contact with the cassette which could cause particulation.

  • Optical and mechanical sensors combined with software logic guard against operation errors such as trying to transfer wafers into a cassette which is already loaded with wafers.

  • User-friendly fail-safe operation features simple one-button actuation and LEDs to guide operator through the transfer sequence.

  • Sturdy construction assures high reliability and robustness required in high throughput fabs.

  • Small footprint saves valuable cleanroom space.

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AVT8AC

Vertical Transfer Machine
  • Vertical plastic to quartz transfer machine for up to 200mm wafers.

  • Ideal for transferring thin wafers.

  • Small footprint saves valuable cleanroom space.

  • Proprietary wafer lifter minimizes alignment problems.

  • Cassettes move, rather than wafers, for safer, cleaner transfer.

  • Absence of comb pivot points above wafers ensures cleanliness.

  • Single button operation makes unit very user-friendly.

  • Simple design for reliability and low maintenance.

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Metal Cassettes for Thin Wafers
  • Proprietary aluminum plating allows sharp edged wafers to be transferred smoothly.

  • H-Square metal cassettes can be modified to non-standard pitches to provide room for wafer safety.

  • Available for all sizes of wafers.

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WP6-AC

Inspection/Presentation System for Thin Wafers
  • Presents wafers for inspection without removal from cassette.

  • Custom wafer lifter made to fit many sizes of thin wafers.

  • Special v-groove saddle gently lifts wafers without contacting others in the cassette.

  • Units can be used with outside diameter mechanical edge picks.

  • ESD safe and class 1 cleanroom compatible.

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