
T693PKAS3-001 |
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Thin
Wafer Handling Tips
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Thin, one piece molded Press-Fit tip
for general handling of thin or fragile substrates up to 200mm
in diameter (.005" - .015" thick).
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Molded from rigid carbon filled PEEK
for strength and ESD protection.
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Excellent adhesion to wafers with
minimum distortion or stress to the substrate.
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Applications include handling of
larger size fragile substrates (e.g., GaAs, GN, SiGe, InGaP,
etc.).
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ETAS6
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AETWNA8AC
Patent# 5,551,829 |
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Auto
Wafer Aligners and Escalators
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Aligns and escalates
wafers in 24 seconds so operator can view ID.
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Allows quick view of
wafer edges and film patterns.
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Small footprint saves
tabletop space.
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Units are modified to
work with wafers as thin as 0.007".
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AFEZ-6AC
Patent # 4,662,811
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Flat/Notch
Finders
EZ
Guide auto flat and notch finders provide safe means of aligning thin wafer
flats or notches.
Cassette
positioning system assures that cassettes are seated correctly for
safe operation.
ESD
protected by static-dissipative plastics.
Proprietary
static-dissipative polyurethane roller withstands more than
2,000,000 cycles with accuracy of less than +1º.
Units
are modified to work with wafers as thin as 0.007".
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LCTAS8-AC
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Low
Contact Wafer Transfer Machine
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Low
contact transfer machine provides safe means of mass
transferring thin wafers from cassette to cassette.
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Wafers
are gently lifted midpoint in the cassette slots before
extracting or loading them to minimize contact with the cassette
which could cause particulation.
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Optical
and mechanical sensors combined with software logic guard
against operation errors such as trying to transfer wafers into
a cassette which is already loaded with wafers.
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User-friendly
fail-safe operation features simple one-button actuation and
LEDs to guide operator through the transfer sequence.
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Sturdy
construction assures high reliability and robustness required in
high throughput fabs.
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Small
footprint saves valuable cleanroom space.
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AVT8AC
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Vertical
Transfer Machine
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Vertical plastic to quartz transfer machine for
up to 200mm wafers.
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Ideal for transferring thin wafers.
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Small footprint saves valuable cleanroom space.
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Proprietary wafer lifter minimizes alignment
problems.
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Cassettes move, rather than wafers, for safer,
cleaner transfer.
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Absence of comb pivot points above wafers
ensures cleanliness.
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Single button operation makes unit very
user-friendly.
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Simple design for reliability and low
maintenance.
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Metal
Cassettes for Thin Wafers
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Proprietary aluminum
plating allows sharp edged wafers to be transferred smoothly.
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H-Square metal
cassettes can be modified to non-standard pitches to provide
room for wafer safety.
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Available for all
sizes of wafers.
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WP6-AC
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Inspection/Presentation
System for Thin Wafers
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Presents wafers for
inspection without removal from cassette.
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Custom wafer lifter
made to fit many sizes of thin wafers.
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Special
v-groove saddle gently lifts wafers without contacting others in
the cassette.
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Units
can be used with outside diameter mechanical edge picks.
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ESD safe and class 1
cleanroom compatible.
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