H-Square Thin Wafer Handling Products

Handling Tools for the Electronics Industry

THIN WAFER HANDLING PRODUCTS

THIN WAFER HANDLING
Thinning of an IC chip improves the total efficiency, as it allows a more efficient cooling, faster speed and,
as an added benefit, the design of smaller form factor devices. H-Square can build on its extensive
experience in thin wafer handling technology to support its customer's requirements. Thin wafer handling
capabilities generally enable the handling of wafers during and after backside grinding, where the substrate
is thinned down to the single digit micrometer scale. H-Square has developed thin wafer handling products
for every type of substrate. Our unique thin wafer handling transfers, aligners, vacuum wands, presenters
and cassettes are in use at our customer sites around the globe.

MISC1400 OFFSET THIN WAFER VACUUM WAND
150mm, 200mm and 300mm ESD safe thin wafer vacuum wand. Horizontal offset
"Hoop Style" for supporting 80µ - 250µ thin inverted wafers from backside. Material:
T7071 aluminum with PFA coating. Ships complete with end effector tip, NO3AS1
wand handle, CC11SDS coil cord, and HSU3PT wand holder

MISC1400-004 for handling 200mm and 300mm thin wafers
MISC1400-008 for handling 150mm and 200mm thin wafers

MISC1400 STRAIGHT THIN WAFER VACUUM WAND
200mm and 300mm ESD safe thin wafer vacuum wand. Straight "Hoop Style" for
supporting 80µ - 250µ thin wafers from the backside. Material" T7071 aluminum
with PFA coating. Ships complete with end effector tip, NOASPF2 wand handle,
CC11SDS coil cord, and HSUPT wand holder

MISC1400-006 for handling 200mm and 300mm thin wafers

300mm "U" SHAPED THIN WAFER VACUUM WAND
300mm ESD safe thin wafer vacuum wand. Backside supporting vacuum wand end
effector for handling 80µ - 250µ thin wafers. Material is T7071 aluminum with HCP
coating. Ships complete with end effector tip, NO3AS1 wand handle, CC11SDS coil
cord, and HSU3PT wand holder

NO3T3-001 for handling 300mm thin wafers

200mm TAIKO STYLE WAFER VACUUM WAND
ESD safe PEEK vacuum wand assembly for handling TAIKO and MEMS style wafers
from the edge exclusionary area.

NO3T3PKAS-007 for handling 200mm thin wafers with 4mm edge

OFFSET 300mm THIN WAFER TIP/WAND ASSEMBLY
45 degree angle horizontal offset ESD safe PEEK thin wafer handling wand/tip
assembly. Recommended for 220µ - 350µ thick 300mm wafers.

NO3T3PKAS-008 for handling 300mm thin wafers

300mm THIN WAFER TIP
300mm ESD safe PEEK thin wafer tip. Recommended for 220µ - 350µ thick 300mm
wafers. Compatible with standard NO3AS1 standard vacuum wand.

T3PKAS1-001 for handling 300mm thin wafers.

T791PKAS 50mm-75mm ESD safe PEEK thin
wafer vacuum tip

T792PKAS 75mm-100mm ESD safe PEEK
thin wafer vacuum tip

T794PKAS 100mm-150mm ESD safe PEEK thin
wafer vacuum tip

T693PKAS3-001 75mm-200mm ESD safe
PEEK thin wafer vacuum tip

T693PKAS2D-001 75mm-200mm ESD safe
PEEK thin wafer vacuum tip - 20 degree bend
down

Recommended ESD safe vacuum set -
vacuum tip, plus NOASPF2 wand, HSU holder
and CC11SDS coil cord

LCT - LOW CONTACT TRANSFER SYSTEMS
Semiautomatic ESD safe thin wafer low contact transfer. Custom programming for
thin wafer transfer applications. Gently transfers wafers from cassette to cassette for
the most critical areas including back-grinding operations. Optional H-Bar up
compatibility for reorientation wafers 180 degrees. Six programming and mechanical
safeguards to protect wafers during transfer operations.

LCTAS6 150mm thin wafer transfer system
LCTAS8 200mm thin wafer transfer system
LCTAS12 300mm thin wafer transfer system

WT HORIZONTAL WAFER TRANSFER - THIN WAFER
ESD safe 200mm thin wafer slide transfer for 200µ -350µ thin wafers.
Transfer arm has three point contact to prevent thin wafers from “rolling”
Design reduces the abrasion of sharp thin wafers against the inside slot of the
cassette which will lead to edge chipping when the cassette is damaged.
Transfer features cassette height adjustment risers to correct for slot alignment
issues as most wafer cassette slots are designed for standard thickness wafers.

WT28HAS-022 200mm thin wafer transfer system

FUJI BAKELITE THIN WAFER BI PITCH CASSETTES
ESD safe 150mm and 200mm bi-pitch 13 slot COC plastic thin wafer cassettes.
Features wide slots and extended wafer supports to aid in keeping thin wafers flat
for robotic process applications. Available with or without handles. Compatible
storage boxes are available.

FB20A106H01 200mm thin wafer bi-pitch plastic cassette, with handle
FB20A106H02 200mm thin wafer bi-pitch plastic cassette
FB15A101H01 150mm thin wafer bi-pitch plastic cassette, with handle
FB15A101H02 150mm thin wafer bi-pitch plastic cassette

MC12 SERIES 300mm ALUMINUM THIN WAFER CASSETTE
300mm all welded aluminum bake cassette. Lightweight ergonomic design minimizes
weight and potential for operator fatigue. Made from aluminum to provide
dimensional stability over time and temperature changes. Features SEMI standard
kinematic coupling positioners and info pad. Transfer compatible with all FOUP and
FOSB carriers. Weighs only 9 lbs. Standard plastic FOUP weighs approximately
10lbs. Cassette features wafer retaining lock-bar for safe transportation of wafers in
a horizontal wafer position.

MC12-13HC 300mm thin wafer bake cassette

SSC THIN WAFER STAINLESS STEEL CASSETTES
For high temperature wafer bake-out applications or specialty applications, including
megasonic and cleaning processes. All welded 316SST electro-polished
construction. Outside dimensions are similar to SEMI standard plastic process
carriers. Transfer and automation compatible. Light Weight: Standard SST 200mm
cassette ~2.5lbs. Temperature: maximum recommended continuous operating
temperature without causing distortion is 550º Celsius. Corrosion Resistance:
316SST offers better resistance than 302 and 304 SST; resists many industrial
chemicals and solvents including: sodium and calcium brines, hypo chlorite
solutions, phosphoric acid, sulfite liquors, and sulfurous acids. Standard
cassettes are designed for 75mm, 100mm, 125mm, 150mm and 200mm, 25-slot
wafer configurations. Non standard 10-slot, 12-slot, 13-slot, 26-slot and 28-slot
cassettes, as well as carriers for square substrates and other non-standard
diameters and wafer thicknesses are available upon request.

Please contact H-Square sales for product ordering part number

EZ GUIDE THIN WAFER NOTCH AND FLAT FINDERS
Unique wafer roller and alignment system gently captures and positions notches for
clean and accurate operation. Special material roller resists the cutting action from
thin wafer rotation. Open design allows increased laminar airflow and improves
cleanliness while minimizing footprint. User-friendly single button operation for fast
but safe cycle time. LED gives operator visual verification of end of cycle. EZ Guide
positioners assure properly positioned cassettes. ESD protected by static-
dissipative plastics. Proprietary static-dissipative polyurethane roller withstands
more than 2,000,000 cycles from SEMI standard wafers with accuracy of better than
1°. Each unit individually tested and certified Class 1 cleanroom compatible and
ESD safe. Test data documentation is packed with each unit.

Please contact H-Square sales for product ordering part numbers