Handling Tools for the Electronics Industry
MECHANICAL WAFER HANDLING PICKS
OUTSIDE DIAMETER & MECHANICAL CLAMP HANDLING TOOLS
H-Square has over 30 years experience providing clean room mechanical handling tools to the
Semiconductor, Automotive, Photo Lithography and Medical industries.
The ODP tool is a fully mechanical tool, which provides edge only handling of substrates using v-groove
profile grippers or edge clamp technology.
The MCP tool was originally developed for MEMS wafer handling applications, however, many customers
have found them to be useful for wafer sampling and removing wafers from a process tool. These tools are
highly customized for specific applications and are available for all wafer sizes and thicknesses. Please
contact H-Square’s Custom Products Department or inquire through your local H-Square sales
representative.

MCP SERIES MECHANICAL CLAMP PICKS
Designed by ergonomic engineering specialist Minh Truong, these normally
closed, outside diameter wafer edge handling tools are a fully mechanical tool
which provides clean constant-force handling of substrates using high
performance plastics and Kalrez touch pads. The MCP tools are highly
customized for specific applications and are available for substrates of all sizes,
materials and thicknesses. Please contact H-Square's Custom Products
Department or inquire through your local H-Square sales representative.


ODP SIDE GRIP MPS STYLE MECHANICAL PICK
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.

ODP HORIZONTAL GRIP MPH MECHANICAL WAFER PICK
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.



ODP THREE POINT CONTACT MECHANICAL WAFER PICK
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.



Nu-TwEZer™ SMALL DEVICE HANDLING TOOL
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.

ODP SERIES HOOP STYLE WAFER EDGE MECHANICAL PICK
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.

ODP HORIZONTAL OFFSET HOOP STYLE WAFER EDGE MECHANICAL PICK
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.

HDCP SERIES MECHANICAL SMALL DEVICE HANDLING TOOL
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.

MPH SERIES CORNER-TO-CORNER SQUARE WAFER MECHANICAL PICK
H-Square manufactures an extraordinary number of different types of mechanical
picks for many different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and applications/equipment, as well as for a
complete range of temperature and chemical environments.
H-Square’s mechanical wafer and substrate picks are the perfect solution for
precision edge handling where contact with the face and backside of the
substrate is prohibited. These ergonomically engineered, cleanroom tools give
the operator the control necessary to finesse expensive or fragile parts. Please
contact your local H-Square sales person for information.
MCP Style Mechanical Edge Pick -
customer defines edge exclusion zone
and materials to be used
ODP three
gripper design
Special application mechanical
pick for concave substrate
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