H-Square MEMS Handling Products

Handling Tools for the Electronics Industry

MEMS HANDLING PRODUCTS

Micro-Electro-Mechanical Systems (MEMS) have a significant impact across a wide application range from
automotive and industrial process control sensors airbag deployment, digital mirrors for optical projection systems,
pressure sensors, ink jet heads, hard disk drives, tunable filters for RF-technology or silicon microphones.
All these devices need equipment for fabrication and assembly.
MEMS in wafer form are typically extremely sensitive to their environment. This sensitivity makes handling MEMS
devices a challenge at every manufacturing step. With a complete range of handling tools for MEMS, H-Square has
positioned itself as a leader in high-yield MEMS manufacturing, and thus a primary supplier of innovative equipment
solutions for the MEMS market.

ODP - MPS SERIES WAFER MECHANICAL PICKS
Edge only contact mechanical picks for handling MEMS
style wafers. H-Square manufactures an extraordinary
number of different types of edge grip picks for many
different sizes, shapes, weights and materials of wafers,
substrates, dies and packages and
applications/equipment, as well as for a complete range
of temperature and chemical environments

FB20A106H01
200mm ESD-safe COC Fuji Bakelite Bi-Pitch Carrier
13 slot - for processing thin or thick substrates.
Available with and without a handle

FB15A101H01 (not pictured)
150mm ESD-safe COC Fuji Bakelite Bi-Pitch Carrier
13 slot - for processing thin or thick substrates.
Available with and without a handle

MCP SERIES MECHANICAL CLAMP PICKS
These normally closed, ergonomic, outside diameter
wafer edge handling tools are a fully mechanical tool
which provides clean constant-force handling of touch
pads. The MCP tools are highly customized for specific
applications and are available for substrates of all sizes,
materials and thicknesses

CUSTOM METAL CASSETTE FOR CARRIER WAFERS
H-Square will design and fabricate custom cassettes to
your specifications for your special requirements.

LCTAS Low Contact Transfer for safe cassette to
cassette transfer of thin or fragile wafers

MISC2100 Series wafer lifter
block for presenting selective
wafers to an operator

MISC1400 "TAIKO Style"
MEMS wafer edge
handling 200mm ESD safe
vacuum wand