H-Square LED Handling Products

Handling Tools for the Electronics Industry

LED HANDLING PRODUCTS

LEDs (Light Emitting Diodes) are based on compound semiconductors and portable electronics and
automotive illumination. Other applications include optical communications, photo-voltaics and power
semiconductors. Substrates for these applications include such materials as Gallium Arsenide (GaAs), Indium
Phosphide (InP), Silicon Carbide (SiC) and Sapphire. All of these compound semiconductor materials pose
specific handling tool challenges, whether it be the wafer size, thickness or the fragility of the material.
H-Square tools are specially engineered for these materials and incorporate specialized modifications to
wafer aligners, transfers, vacuum wands, presenters, cassettes, and mechanical handling picks.

SQ21733-8
EZ Guide 12 slot ePak cassette version - antistatic automatic
wafer notch aligner for 150mm notched substrates. Class 1

SQ22143-3 (not pictured)
EZ Guide 25 slot cassette version - antistatic automatic wafer
aligner for 150mm notched substrates. Class 1

Manual EZ Guide aligners also available

WT3H-002
Cassette to cassette slide transfer for unloading 75mm Sic
and Sapphire substrates from an ePak shipping cassette

WT3H-001 (not pictured)
Cassette to cassette slide transfer for loading a 75mm ePak
shipping cassette (no h-bar design)

T693PKAS3 + NOASPF2 + HSU + CC11SDS Recommended ESD safe house vacuum setup for general handling 150mm heavy substrates like SiC and sapphire. T696PK - Optional UHMW and PEEK vacuum tip available for wafer makers.

T691PKAS + NOASPF2 + HSU + CC11SDS Recommended ESD safe house vacuum setup for general handling of 50mm, 75mm and 100mm LED substrates T691PK-001 (not pictured) Optional UHMW and PEEK vacuum tip available for wafer makers.

ODP-3-001 ESD safe 75mm
3-point mechanical gripper pick

ETAS1 ESD safe wafer
presenter escalator