H-Square Semiconductor Products

SEMICONDUCTOR HANDLING PRODUCTS

Handling Tools for the Electronics Industry

Thirty-six years of serving the semiconductor industry makes H-Square the world's most experienced
manufacturer of wafer handling tools. As always, we continue our tradition of providing customers with
products which are both pragmatic and economical solutions to handling problems, and which are
manufactured to the highest standards of quality. We appreciate the support and we hope to be your
industry partner for many years to come.

LCTAS SERIES LOW CONTACT TRANSFER
A popular transfer tool for moving 300mm wafers between a FOSB
and FOUP, or a FOUP and metal cassette. The LCTAS12 safely
transfers 25 wafers at a time in less than 30 seconds. An integrated
mapping sensor protects against cross-slotting and double stacked
wafers. This system is certified at a Class 1 cleanroom level for
cleanliness. LCTAS systems are also available for 200mm and
150mm SEMI standard cassettes.

LCTAS12 for 300mm wafers
LCTAS8 for 200mm wafers
LCTAS6 for 150mm wafers

FUJI BAKELITE PLASTIC THIN WAFER CASSETTES
A popular thin wafer handling cassette for wafer handling during final
production, test and probe operations. The material is antistatic
cyclic olefin copolymer for extreme abrasion resistance. The
cassette features 13 slots, and extra wide slot platform to reduce
thin wafer warping. Both the 200mm and 150mm designs are
available with and without end wall handles.

FB20A106H01 200mm cassette, with handle
FB20A106H02 200mm cassette, no handle
FB15A101H01 150mm cassette, with handle
FB15A101H02 150mm cassette, no handle

MCP SERIES MECHANICAL CLAMP PICKS
These normally closed, ergonomic, outside diameter wafer edge
handling tools are a fully mechanical tool which provides clean
constant-force handling of touch pads. The MCP tools are highly
customized for specific applications and are available for substrates
of all sizes, materials and thicknesses.

Contact H-Square for ordering information

300mm ALUMINUM WELDED 25 SLOT CASSETTES
Lightweight ergonomic design minimizes weight and potential for
operator fatigue.
Made from welded hard clear anodized aluminum to provide
dimensional stability over time and temperature changes.
Temperature: maximum recommended continuous operating
temperature without causing distortion is 350º Celsius. Features
SEMI standard kinematic coupling positioners and info pad. Transfer
compatible with all FOUP and FOSB carriers.
Weighs only 6.5lbs. Standard plastic FOUP weighs approximately 10
lbs. Cassette features wafer retaining lock-bar for safe
transportation of wafers in a horizontal wafer position.

MC12-25HC1 300mm SEMI standard Bake and Process Cassette

MISC1400 OFFSET THIN WAFER VACUUM WAND
150mm, 200mm and 300mm ESD safe thin wafer vacuum wand.
Horizontal offset "Hoop Style" for supporting 80µ - 250µ thin inverted
wafers from backside. Material: T7071 aluminum with PFA coating.
Ships complete with end effector tip, NO3AS1 wand handle,
CC11SDS coil cord, and HSU3PT wand holder

MISC1400-004 for handling 200mm and 300mm thin wafers
MISC1400-008 for handling 150mm and 200mm thin wafers

H-Square has more than 2000 products engineered to safely handle semiconductor wafers in a cleanroom environment. The above links
will guide you towards the product family page for each category within H-Square's extensive product library. When our standard product
offerings are not able to address your application requirements, contact your local H-Square sales professional. We'll work with our custom
products engineering department to explore an innovative, quality solution to your particular application needs.

Vacuum Handling Tools

Wafer Aligners

Wafer Cassettes

Cassette Transfer
Systems

Wafer Presenters