Handling Tools for the Electronics Industry
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COMPOUND SEMICONDUCTOR HANDLING PRODUCTS
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H-Square's extensive experience in handling Compound Semiconductor materials has brought innovation and low
cost solutions to benefit both R&D and production-scale compound semiconductor manufacturing groups.
Automated systems and a wide variety of manual handling tools have been developed for emerging technologies
in wireless networks and optoelectronic manufacturing. Driven by the demand for wireless technology, gallium
arsenide (GaAs) has been the most used compound semiconductor material by volume. In addition, sapphire and
silicon carbide (SiC) have been benefiting from the booming LED market, while gallium nitride (GaN) has become
the preferred choice for blue laser diode makers. Indium Phosphide (InP) is increasingly used for fiber-optic
communication applications. The unique properties, applications and high cost of compound semiconductor
materials dictate special handling considerations and tooling. H-Square has extensive knowledge for handling
these unique substrates and can offer compound semiconductor customers a wide range of handling solutions.
cost solutions to benefit both R&D and production-scale compound semiconductor manufacturing groups.
Automated systems and a wide variety of manual handling tools have been developed for emerging technologies
in wireless networks and optoelectronic manufacturing. Driven by the demand for wireless technology, gallium
arsenide (GaAs) has been the most used compound semiconductor material by volume. In addition, sapphire and
silicon carbide (SiC) have been benefiting from the booming LED market, while gallium nitride (GaN) has become
the preferred choice for blue laser diode makers. Indium Phosphide (InP) is increasingly used for fiber-optic
communication applications. The unique properties, applications and high cost of compound semiconductor
materials dictate special handling considerations and tooling. H-Square has extensive knowledge for handling
these unique substrates and can offer compound semiconductor customers a wide range of handling solutions.
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Copyright © 2011 - H-Square Corporation Santa Clara, California, USA All Rights Reserved
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| MCP - mechanical edge grip pick |
| ETAS1 - manual wafer escalator |
| MFEZ - manual EZ-Guide™ flat aligners |